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Logic Burn-In BoardSpecifications
Maker
Model
Unitest
U940A, U938, U930
Digital
FrontierDF2200, FOS1540
AEHR
ABTS-Pi
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Memory Burn-In BoardSpecifications
Maker
Model
Unitest
U940A, U938, U930
Digital
FrontierDF2200, FOS1540
AEHR
ABTS-Pi
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U940A High-speed Burn-In BoardSpecifications
Pakage Type DDR4, LPDDR4, GDDR6
Layer 16L
Thickness 2.4T
Material Polymide
Pad Pitch 0.8mm
Impedance 40,50Ω
Aspect Ratio 10
Finish ENIG
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DF2200 High-speed Burn-In BoardSpecifications
Pakage Type NAND, uMCP
Layer 16L
Thickness 2.1T ± 10%
Material Polymide
Pad Pitch 0.8mm
Impedance 50Ω ± 10%
Aspect Ratio 10
Finish ENIG
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ABTS-Pi Logic Burn-In BoardSpecifications
Pakage Type SoC, AP
Layer 18L
Thickness 2.4T
Material Polymide
Pad Pitch 0.4mm
Impedance 50Ω ± 10%
Aspect Ratio 16
Finish ENIG