Products

iSP

  • Probe Head

    High Technology POGO Probe 및 초정밀 가공 Plate의 조합으로 최적화된 Wafer Probing Solution 을 제공합니다. MEMS 공정을 적용한 고성능 MEMS Probe Head 는 Low Force, High CCC, 고강도 Material 의 우수한 Contact 특성으로 고객별 맞춤 Solution 대응이 가능합니다.

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

Solder Bump

Pitch

120um

Characteristics

Signal Path < 2mm

8site 1skip

Package Type

Wire-bond Pad

Pitch

80um

Characteristics

MEMS Point Tip (Rh)

Stable Contact

Package Type

Copper Pillar

Pitch

80um

Characteristics

High CCC > 1A

Low Force Contact

  • Pyramid PIN

    Dut Side Of Contact부를 MEMS 공정을 적용하여 제작한 Pyramid PIN은
    High Hardness (Hv1000)로 내마모성, Sharp Contact Tip으로 Contact 특성이
    우수하여 고객별 맞춤 Solution 대응이 가능합니다.

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
  • Battery PIN

    최고의 기술과 노하우를 바탕으로 Lithium-Polymer Battery 의 충전 및 방전 테스트에
    적합한 Solution을 제공합니다.

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

QFP

Pitch

0.4P

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Current

15A

Characteristics

Sleeve type

Package Type

BGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

LGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

Low Cres

Low Contact Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Dual Contact
(BGA+LGA)

Package Type

BGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

LGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

QFP

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

High Speed

Low Cres

  • RF Socket

    독보적인 기술력, 동축 구조로 임피던스를 매칭하여 우수한 특성
    및 높은 주파수에 대응하는 RF 테스트 소켓을 제공합니다.

    Specifications
    Coaxial Socket RF Probe
    Package Type

    FBGA, LGA, QFN, WLCSP etc
    Available Pitch

    0.7P~

    0.4P~
    Characteristics

    50Ω Impedance Matching

    Coaxial Structure

    40GHz Bandwidth

    Short Probe

    G-S-G > 40GHz @ -1dB

    Low Inductance

    Low CRES
Product Series
Package Type

BGA, LGA

Pitch

0.7P~

Characteristics

Air Coaxial Structure

Impedeance 50Q

Insertion Loss 40Ghz@ - 1dB

Return Loss 40Ghz@ - 1dB

Package Type

BGA, LGA, QFN

Pitch

0.3P~

Characteristics

Short Probe

G-S-G > 40Ghz@ - 1dB

Low Inductance

Low CRES