Probe Head

  • High Technology POGO Probe 및 초정밀 가공 Plate의 조합으로
    최적화된 Wafer Probing Solution 을 제공합니다.
    MEMS 공정을 적용한 고성능 MEMS Probe Head 는 Low Force, High CCC,
    고강도 Material 의 우수한 Contact 특성으로 고객별 맞춤 Solution 대응이 가능합니다.

Specifications

POGO Probe Head MEMS Probe Head
Package Type Wafer (WLCSP) Wafer (SOC)
Available Pitch 120um~ 80um~
Characteristics - RF type, Signal length 2.0mm
- Solder Bump
- Wafer Probing & Single Die TEST
- High CCC > 1A
- Copper Pillar (Flat type)
- Wire Bond Pad (Point Type)
Product Series
  • Package Type Solder Bump
    Pitch 120um
    Characteristics - Signal Path < 2mm
    - 8site 1skip
  • Package Type Wire-bond Pad
    Pitch 80um
    Characteristics - MEMS Point Tip (Rh)
    - Stable Contact
  • Package Type Copper Pillar
    Pitch 80um
    Characteristics - High CCC > 1A
    - Low Force Contact