Logic Test Socket

  • Long Test Time, Short Test Time, High Speed, 대 면적 등 Application에 따른
    Logic Device/PKG. Test에 최적화된 Solution을 제공합니다.

Specifications

Package Type BGA, LGA, QFN, QFP, CSP, SOP, TSOP etc.
Available Pitch 0.25P~
Characteristics - AP, CPU, GPU, PMIC, RF, Sensor, Mixed signal
- Validation, SLT, ATE
- Low Cres, High Speed, High Voltage Test Solution
- No Ball Damage
- Customizing Test
Product Series
  • Package Type AP
    Pitch 0.3P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type CPU
    Pitch 0.3P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type GPU
    Pitch 0.5P~
    Characteristics - Long Life Span
    - No Ball Damage
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type BGA
    Pitch 0.3P~
    Characteristics - Long Life Span
    - Validation, SLT, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type LGA
    Pitch 0.3P~
    Characteristics - Long Life Span
    - Validation, ATE
    - High Speed
    - Low Cres
    - Low Contact Force
  • Package Type QFP
    Pitch 0.4P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres
  • Package Type QFN
    Pitch 0.35P~
    Characteristics - Long Life Span
    - High Speed
    - Low Cres