Burn In Socket

  • Rubber를 응용한 Burn In Test Socket으로,
    Device No Ball Damage, PCB No Soldering, Hi Speed 구현 등
    우수한 특성 및 구조로, 고객 맞춤형의 최적화된 Solution을 제공합니다.

Specifications

구분 DC BI Socket Normal BI Socket High Speed BI Socket
Package Type BGA, LGA etc. BGA, LGA, QFN etc. BGA etc.
Available Pitch 0.3P~ 0.3P~ 0.8P~
Characteristics - Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Life Cycle > 100K
- No Ball Damage
- Board 수리 용이
- Hi Speed Test 구현
Product Series
  • Package Type BGA, LGA etc.
    Pitch 0.3P~
    Characteristics - Life Cycle > 100K
    - No Ball Damage
  • Package Type BGA, LGA, QFN etc
    Pitch 0.3P~
    Characteristics - Life Cycle > 100K
    - No Ball Damage.
    - Hi Speed 대응
  • Package Type BGA etc.
    Pitch 0.8P~
    Characteristics - Life Cycle > 100K
    - No Ball Damage,
    - Board 수리 용이